Topic: Fully-Integrated Micro-Display Design
Speaker: Associate Professor JIANG Junmin, Southern University of Science and Technology (SUSTech)
Date and time: 14:00–15:00, May 6
Venue: Room 1A-200, SIST
Host: LIANG Junrui
Abstract:
In MicroLED display systems, power management IC and display drivers are major bottlenecks that limit further integration of MicroLED technology. This talk presents a fully-integrated active matrix light-emitting diode (AMLED) microdisplay system that addresses these limitations. The system consists of a GaN-on-Silicon AMLED array chip and a silicon driver chip that integrates on-chip hybrid regulators, pixel drivers, and peripheral circuits. The two chips are bonded using a low-cost non-gold flip-chip bonding technique. The system can operate directly from a battery without the need for external components. Several techniques were used to achieve system integration, including: (1) a fully-integrated hybrid regulator that cascades a buck linear regulator with a boost switch-capacitor converter; (2) MicroLEDs using GaN-on-Silicon substrates that significantly reduce crosstalk between pixels while lowering costs; and (3) a non-gold flip-chip bonding technique that reduces bonding costs and provides reliable connections between the AMLED array chip and the silicon driver chip. This work demonstrates the potential of high integration, high efficiency, low cost, and fully-integrated MicroLED microdisplay systems.
Biography:
JIANG Junmin received his B.Eng. degree in Electronic and Information Engineering from Zhejiang University in 2011, and got his Ph.D. degree in Electronic and Computer Engineering from the Hong Kong University of Science and Technology (HKUST) in 2017.
He was a visiting scholar at the State Key Laboratory of AMSV, University of Macau in 2015, and was a postdoc fellow at HKUST in 2017. He was an analog design engineer at Texas Instruments in Santa Clara from 2018 to 2021. In 2021, he joined SUSTech where he is currently an Associate Professor. His research interests focus on the design of power management IC, especially in switched-mode power converter design.
He also serves as an Associate Editor and Guest Editor of IEEE TCAS2, and a Review Committee Member of IEEE ISCAS from 2021 to 2023. He was a recipient of the IEEE Solid-State Circuits Society (SSCS) Student Travel Grant Award 2015, the Analog Devices Inc. (ADI) Outstanding Student Designer Award in 2015, the Solomon Systech Scholarship in 2017, the IEEE Solid-State Circuits Society (SSCS) Pre-Doctoral Achievement Award 2016–2017, the ASP-DAC University LSI Design Contest Special Feature Award in 2018, the Texas Instruments Patent Awards in 2019-2020, the NSFC Excellent Young Scientists Fund (Overseas) in 2022.